Apple is said to be busy solving several reported technical issues in 3D camera production. The other report claims that TSMC has already begun mass producing the Apple A11 SoC on the 10nm process, the SoC set to be integrated in the new iPhone models this year. 2643q
The Investor cites a Korea Economic Daily report to claim that the first to suggest this feature on the iPhone 8.
Separately, a new report from DigiTimes suggests that TSMC has started mass producing the new Apple A11 SoC. The company is set to be the sole supplier of these SoCs, without Samsung in the equation, which is expected to be included in all three new iPhone models tipped to arrive this fall.
The report confirms that TSMC faced initial yield issues, but it seems to have solved that now. “TSMC has begun 10nm chip production for Apple’s next-generation iPhone 8 series, the sources said. Production was once affected by issues involving stacking components in the backend integrated fan-out packaging process, but they have already been solved,” sources told DigiTimes.
The iPhone 8 is also expected to sport 3GB of RAM, vertical dual rear camera setup, bundled AirPods, wireless charging, waterproofing, and much more.