Intel 'Lakefield' Hybrid Us Launched 624v6f Combining Core and Atom Architectures for Folding Screen Laptops

These Us will power a new generation of ultraportable laptops. 6z3657

By Jamshed Avari | Updated: 10 June 2020 20:58 IST

Intel 'Lakefield' Hybrid Us Launched, Combining Core and Atom Architectures for Folding Screen Laptops

Lakefield is a hybrid U using multiple heterogenous blocks across 3D stacked layers 39n5n

Highlights

Lakefield Us have one high-performance core and four low-power cores
Intel claims a massive reduction in idle power consumption
The first Lakefield-based laptop will go on sale this month

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Intel has announced its first hybrid Us that combine its high-power and low-power architectures, usually used in the separate Core and Atom product lines. The new 'Lakefield' U series models are targeted at ultra-portable laptops and new form factors including dual-screen and folding-screen models. Two Us have been announced, the new Intel Core i5-L16G7 and Core i3-L13G4, each with one high-power core and four high-efficiency cores. They will first be seen in Lenovo's ThinkPad X1 Fold and Samsung Galaxy Book S. This is also the first consumer application of Intel's Feveros 3D stacking U construction technology.

8th Gen Core i7 Y-series mobile U.

The Core i5-L16G7 and Core i3-L13G4 both feature one previous low-power designs found in Atom, Celeron and Pentium Silver Us in the desktop, server, and embedded spaces.

The new hybrid Us will be part of Intel's 10th Gen Core series alongside existing parts based on the Ice Lake and Comet Lake architectures. They will be differentiated by their numbering scheme, which shows the relative power of each U and its integrated graphics capabilities, mirroring the current Ice Lake laptop family. They will be officially described as "Intel Core processors with Intel Hybrid Technology".

Both new models have 7W TDP ratings and 4MB of cache memory. The Core i5-L16G7 has a base speed of 1.4GHz across all cores with single-core (the Sunny Cove core only) and all-core boost speeds of 3GHz and 1.8GHz respectively. It features 64 Gen11 graphics execution units. The Core i3-L13G4 runs at 800MHz with boost speeds of 2.8GHz and 1.3GHz respectively, and has 48 graphics execution units.

Intel promises a huge leap in graphics performance for the 7W TDP U segment. The Lakefield chips are also said to be the first with dual graphics pipelines, specifically optimised for multi-screen devices. On-chip AI inference extensions are also ed, like with Ice Lake On the platform level, there is for Gigabit-class Wi-Fi 6 and LTE solutions and LPDDR4X-4267 RAM.

The Foveros 3D stacking technique allowed Intel to develop this modular design, leveraging blocks of technology with different architectures. Lakefield combines 10nm cores with larger IO components based on older processes, much like Zen 2 architecture. This could help Intel deal with its ongoing 10nm manufacturing difficulties.

The Lakefield chips measure 12mm square and 1mm thick. The concept of combining heterogenous high-power and low-energy U cores is common in the ARM-based mobile U space, with the arrangement commonly referred to as "big.Little". Intel says that the Windows 10 scheduler is fully capable of asg tasks to an appropriate core using "hardware-guided" scheduling.

Samsung's concept folding laptop based on a Lakefield U at CES 2020.

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